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Carsem |
| Carsem
(M) Sdn Bhd |
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| The
semiconductor assembly and test businesses are undertaken
by the Carsem Companies, Carsem
(M) Sdn Bhd and Carsem Semiconductor (Suzhou) Co., Ltd.
The current combined operations of the Carsem Companies (Carsem)
make them one of the six largest independent semiconductor
sub-contract assembly houses in the world, producing
over 100 million units per week and more than 65% of this
volume is shipped as fully tested product. Carsem is recognised
as a leading provider of turnkey packaging and test services
to the semiconductor industry, and offers one of the widest
range package & test portfolios in the world.
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Carsem's
end-market is relatively more diversified due to Carsem's
wide range of IC packages. Packages cover the widest
package range in the industry from a simple low pin
count micro device to the more advanced high pin count and
high value packages. Carsem also provide a full range of turnkey
test services for RF, mixed-signal, analog, digital and power
devices. The flexibility in production allows Carsem to supply
to different market sectors, such as the industrial, telecommunications,
information technology, consumer and automotive thus avoiding
over-dependence on any particular sector. Carsem also
provides full final test services, supported by extensive
R&D and failure analysis laboratories.
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Product
Groups manufactured include: -
MLP (Micro Leadframe Package)
SiP (System in Package )
ARRAY (wide selection of SSBGA (Small Scale Ball Grid Array)
packages using Organic, Flex-Tape and Ceramic substrates in
both Ball Grid and Land Grid formats)
FCOLTM
(Flip Chip on Leadframe) - Patent Pending
MICRO
(variety of lower lead count industry standard packages for
the manufacturers of Micro IC's and components)
POWER
(surface mountable and thermally enhanced packages for power
management IC's and power devices)
SOP
(Small Outline Package)
QFP
(Quad Flat Package)
PDIP
(Plastic Dual-In-Line Package)
PLCC
(Plastic Leaded Chip Carrier) |
Carsem
(M) is situated at Jalan Lapangan Terbang,
Ipoh, Malaysia (called "m-site") and Taman
Meru Industrial Estate, Jelapang, Malaysia (called "s-site").
Both plants are located at the state of Perak and are approximately
16km apart. In total, Carsem (M) employ more than 9,000 people.
M-site is predominantly involved in the production of micro
and power packages while the s-site plant produces the higher
I/Os thin fine pitch packages and also high-end test services.
Both factories maintain world-class quality standards having
achieved ISO/TS 16949, SAC Level , ISO 9001, ISO-14001, QS-9000
certifications.
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Carsem
Semiconductor (Suzhou) Co., Ltd,
is located in the province of Jiangsu, 50 miles (80Km) west
of Shanghai. The new factory is 172K sq. ft. (16K sq. m.)
and is on 430K sq. ft. (40K sq. m.) of land in the Suzhou
Industrial Park. The construction started April 2003 and was
completed in January 2004. The initial staff has been through
extensive training in Carsem's existing Malaysian factories
and the assembly and test equipment to support the manufacture
of the MLP (Micro Leadframe Pacakge) Quad and Dual will be
installed during the second quarter of 2004. Initial customer
qualifications were completed the end of the June 2004 and
the factory began shipping production volumes in July 2004.
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Carsem are supported with a global network of sales and
technical support offices. It has marketing offices in Los
Angeles, Boston, Dallas and Silicon
Valley in the United States and
in the United Kingdom (covering marketing
operations in Europe) to meet the demands of international
customers for more local support and services. The functions
of the overseas offices include customer services and technical
support as well as sales and marketing.
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